Region-Based Feature Interpretation for Recognizing 3D Models in 2D Images

In model-based vision, there are a huge number of possible ways to match model features to image features. In addition to model shape constraints, there are important match-independent constraints that can efficiently reduce the search without the combinatorics of matching. I demonstrate two specific modules in the context of a complete recognition system, Reggie. The first is a region-based grouping mechanism to find groups of image features that are likely to come from a single object. The second is an interpretive matching scheme to make explicit hypotheses about occlusion and instabilities in the image features.

Object Recognition with Pictorial Structures

This thesis presents a statistical framework for object recognition. The framework is motivated by the pictorial structure models introduced by Fischler and Elschlager nearly 30 years ago. The basic idea is to model an object by a collection of parts arranged in a deformable configuration. The appearance of each part is modeled separately, and the deformable configuration is represented by spring-like connections between pairs of parts. These models allow for qualitative descriptions of visual appearance, and are suitable for generic recognition problems. The problem of detecting an object in an image and the problem of learning an object model using training examples are naturally formulated under a statistical approach. We present efficient algorithms to solve these problems in our framework. We demonstrate our techniques by training models to represent faces and human bodies. The models are then used to locate the corresponding objects in novel images.

Feature Point Detection and Curve Approximation for Early Processing of Freehand Sketches

Freehand sketching is both a natural and crucial part of design, yet is unsupported by current design automation software. We are working to combine the flexibility and ease of use of paper and pencil with the processing power of a computer to produce a design environment that feels as natural as paper, yet is considerably smarter. One of the most basic steps in accomplishing this is converting the original digitized pen strokes in the sketch into the intended geometric objects using feature point detection and approximation. We demonstrate how multiple sources of information can be combined for feature detection in strokes and apply this technique using two approaches to signal processing, one using simple average based thresholding and a second using scale space.

View-Based Strategies for 3D Object Recognition

A persistent issue of debate in the area of 3D object recognition concerns the nature of the experientially acquired object models in the primate visual system. One prominent proposal in this regard has expounded the use of object centered models, such as representations of the objects' 3D structures in a coordinate frame independent of the viewing parameters [Marr and Nishihara, 1978]. In contrast to this is another proposal which suggests that the viewing parameters encountered during the learning phase might be inextricably linked to subsequent performance on a recognition task [Tarr and Pinker, 1989; Poggio and Edelman, 1990]. The 'object model', according to this idea, is simply a collection of the sample views encountered during training. Given that object centered recognition strategies have the attractive feature of leading to viewpoint independence, they have garnered much of the research effort in the field of computational vision. Furthermore, since human recognition performance seems remarkably robust in the face of imaging variations [Ellis et al., 1989], it has often been implicitly assumed that the visual system employs an object centered strategy. In the present study we examine this assumption more closely. Our experimental results with a class of novel 3D structures strongly suggest the use of a view-based strategy by the human visual system even when it has the opportunity of constructing and using object-centered models. In fact, for our chosen class of objects, the results seem to support a stronger claim: 3D object recognition is 2D view-based.

Geometric and Algebraic Aspects of 3D Affine and Projective Structures from Perspective 2D Views

We investigate the differences --- conceptually and algorithmically --- between affine and projective frameworks for the tasks of visual recognition and reconstruction from perspective views. It is shown that an affine invariant exists between any view and a fixed view chosen as a reference view. This implies that for tasks for which a reference view can be chosen, such as in alignment schemes for visual recognition, projective invariants are not really necessary. We then use the affine invariant to derive new algebraic connections between perspective views. It is shown that three perspective views of an object are connected by certain algebraic functions of image coordinates alone (no structure or camera geometry needs to be involved).

Feature Selection for Face Detection

We present a new method to select features for a face detection system using Support Vector Machines (SVMs). In the first step we reduce the dimensionality of the input space by projecting the data into a subset of eigenvectors. The dimension of the subset is determined by a classification criterion based on minimizing a bound on the expected error probability of an SVM. In the second step we select features from the SVM feature space by removing those that have low contributions to the decision function of the SVM.

On the difficulty of feature-based attentional modulations in visual object recognition: A modeling study.

Numerous psychophysical experiments have shown an important role for attentional modulations in vision. Behaviorally, allocation of attention can improve performance in object detection and recognition tasks. At the neural level, attention increases firing rates of neurons in visual cortex whose preferred stimulus is currently attended to. However, it is not yet known how these two phenomena are linked, i.e., how the visual system could be "tuned" in a task-dependent fashion to improve task performance. To answer this question, we performed simulations with the HMAX model of object recognition in cortex [45]. We modulated firing rates of model neurons in accordance with experimental results about effects of feature-based attention on single neurons and measured changes in the model's performance in a variety of object recognition tasks. It turned out that recognition performance could only be improved under very limited circumstances and that attentional influences on the process of object recognition per se tend to display a lack of specificity or raise false alarm rates. These observations lead us to postulate a new role for the observed attention-related neural response modulations.

Exploring Bit-Difference for Approximate KNN Search in High-dimensional Databases

In this paper, we develop a novel index structure to support efficient approximate k-nearest neighbor (KNN) query in high-dimensional databases. In high-dimensional spaces, the computational cost of the distance (e.g., Euclidean distance) between two points contributes a dominant portion of the overall query response time for memory processing. To reduce the distance computation, we first propose a structure (BID) using BIt-Difference to answer approximate KNN query. The BID employs one bit to represent each feature vector of point and the number of bit-difference is used to prune the further points. To facilitate real dataset which is typically skewed, we enhance the BID mechanism with clustering, cluster adapted bitcoder and dimensional weight, named the BID⁺. Extensive experiments are conducted to show that our proposed method yields significant performance advantages over the existing index structures on both real life and synthetic high-dimensional datasets.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.

A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing

The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.