2 resultados para Different Sizes

em Massachusetts Institute of Technology


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We present a component-based approach for recognizing objects under large pose changes. From a set of training images of a given object we extract a large number of components which are clustered based on the similarity of their image features and their locations within the object image. The cluster centers build an initial set of component templates from which we select a subset for the final recognizer. In experiments we evaluate different sizes and types of components and three standard techniques for component selection. The component classifiers are finally compared to global classifiers on a database of four objects.

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Holes with different sizes from microscale to nanoscale were directly fabricated by focused ion beam (FIB) milling in this paper. Maximum aspect ratio of the fabricated holes can be 5:1 for the hole with large size with pure FIB milling, 10:1 for gas assistant etching, and 1:1 for the hole with size below 100 nm. A phenomenon of volume swell at the boundary of the hole was observed. The reason maybe due to the dose dependence of the effective sputter yield in low intensity Gaussian beam tail regions and redeposition. Different materials were used to investigate variation of the aspect ratio. The results show that for some special material, such as Ni-Be, the corresponding aspect ratio can reach 13.8:1 with Cl₂ assistant etching, but only 0.09:1 for Si(100) with single scan of the FIB.