3 resultados para Contrast ratio

em Massachusetts Institute of Technology


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Baylis & Driver (Nature Neuroscience, 2001) have recently presented data on the response of neurons in macaque inferotemporal cortex (IT) to various stimulus transformations. They report that neurons can generalize over contrast and mirror reversal, but not over figure-ground reversal. This finding is taken to demonstrate that ``the selectivity of IT neurons is not determined simply by the distinctive contours in a display, contrary to simple edge-based models of shape recognition'', citing our recently presented model of object recognition in cortex (Riesenhuber & Poggio, Nature Neuroscience, 1999). In this memo, I show that the main effects of the experiment can be obtained by performing the appropriate simulations in our simple feedforward model. This suggests for IT cell tuning that the possible contributions of explicit edge assignment processes postulated in (Baylis & Driver, 2001) might be smaller than expected.

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Holes with different sizes from microscale to nanoscale were directly fabricated by focused ion beam (FIB) milling in this paper. Maximum aspect ratio of the fabricated holes can be 5:1 for the hole with large size with pure FIB milling, 10:1 for gas assistant etching, and 1:1 for the hole with size below 100 nm. A phenomenon of volume swell at the boundary of the hole was observed. The reason maybe due to the dose dependence of the effective sputter yield in low intensity Gaussian beam tail regions and redeposition. Different materials were used to investigate variation of the aspect ratio. The results show that for some special material, such as Ni-Be, the corresponding aspect ratio can reach 13.8:1 with Cl₂ assistant etching, but only 0.09:1 for Si(100) with single scan of the FIB.

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High aspect ratio polymeric micro-patterns are ubiquitous in many fields ranging from sensors, actuators, optics, fluidics and medical. Second generation PDMS molds are replicated against first generation silicon molds created by deep reactive ion etching. In order to ensure successful demolding, the silicon molds are coated with a thin layer of C[subscript 4]F[subscript 8] plasma polymer to reduce the adhesion force. Peel force and demolding status are used to determine if delamination is successful. Response surface method is employed to provide insights on how changes in coil power, passivating time and gas flow conditions affect plasma polymerization of C[subscript 4]F[subscript 8].