Temperature Sensor Placement Including Routing Overhead and Sampling Inaccuracies
Data(s) |
01/09/2012
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Resumo |
Dynamic thermal management techniques require a collection of on-chip thermal sensors that imply a significant area and power overhead. Finding the optimum number of temperature monitors and their location on the chip surface to optimize accuracy is an NP-hard problem. In this work we improve the modeling of the problem by including area, power and networking constraints along with the consideration of three inaccuracy terms: spatial errors, sampling rate errors and monitor-inherent errors. The problem is solved by the simulated annealing algorithm. We apply the algorithm to a test case employing three different types of monitors to highlight the importance of the different metrics. Finally we present a case study of the Alpha 21364 processor under two different constraint scenarios. |
Formato |
application/pdf |
Identificador | |
Idioma(s) |
eng |
Publicador |
E.T.S.I. Telecomunicación (UPM) |
Relação |
http://oa.upm.es/20503/1/INVE_MEM_2012_136011.pdf http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6339419 info:eu-repo/semantics/altIdentifier/doi/10.1109/SMACD.2012.6339419 |
Direitos |
http://creativecommons.org/licenses/by-nc-nd/3.0/es/ info:eu-repo/semantics/openAccess |
Fonte |
2012 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD) | 2012 International Conference on Synthesis, Modeling, Analysis and Simulation Methods and Applications to Circuit Design (SMACD), 2012 International Conference on | 19/09/2012 - 21/09/2012 | Sevilla |
Palavras-Chave | #Telecomunicaciones #Electrónica |
Tipo |
info:eu-repo/semantics/conferenceObject Ponencia en Congreso o Jornada PeerReviewed |