Three-level cell topology for a multilevel power supply to achieve High


Autoria(s): Díaz López, Daniel; Vasic, Miroslav; García Suárez, Oscar; Oliver Ramírez, Jesús Angel; Alou Cervera, Pedro; Prieto López, Roberto; Cobos Márquez, José Antonio
Data(s)

01/09/2012

Resumo

This paper presents an envelope amplifier solution for envelope elimination and restoration (EER), that consists of a series combination of a switch-mode power supply (SMPS), based on three-level voltage cells and a linear regulator. This cell topology offers several advantages over a previously presented envelope amplifier based on a different multilevel topology (two-level voltage cells). The topology of the multilevel converter affects to the whole design of the envelope amplifier and a comparison between both design alternatives regarding the size, complexity and the efficiency of the solution is done. Both envelope amplifier solutions have a bandwidth of 2 MHz with an instantaneous maximum power of 50 W. It is also analyzed the linearity of the three-level cell solution, with critical importance in the EER technique implementation. Additionally, considerations to optimize the design of the envelope amplifier and experimental comparison between both cell topologies are included.

Formato

application/pdf

Identificador

http://oa.upm.es/15956/

Idioma(s)

eng

Publicador

E.T.S.I. Industriales (UPM)

Relação

http://oa.upm.es/15956/1/INVE_MEM_2012_131563.pdf

http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6148309

info:eu-repo/semantics/altIdentifier/doi/10.1109/TCSI.2012.2185307

Direitos

http://creativecommons.org/licenses/by-nc-nd/3.0/es/

info:eu-repo/semantics/openAccess

Fonte

IEEE Transactions on Circuits and Systems I: Regular Papers, ISSN 1549-8328, 2012-09, Vol. 59, No. 9

Palavras-Chave #Electrónica
Tipo

info:eu-repo/semantics/article

Artículo

PeerReviewed