High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures
| Data(s) |
2015
|
|---|---|
| Resumo |
Laser ablation/ionisation mass spectrometry with a vertical resolution at a nanometre scale was applied for the quantitative characterisation of the chemical composition of additive-assisted Cu electroplated deposits used in the microchip industry. The detailed chemical analysis complements information gathered by optical techniques and allows new insights into the metal deposition process. |
| Formato |
application/pdf |
| Identificador |
http://boris.unibe.ch/74443/1/c5ja00295h.pdf Riedo, Andreas; Grimaudo, Valentine; Moreno-García, P.; Neuland, Maike Brigitte; Tulej, Marek; Wurz, Peter; Broekmann, Peter (2015). High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of analytical atomic spectrometry, 30(12), pp. 2371-2374. Royal Society of Chemistry 10.1039/C5JA00295H <http://dx.doi.org/10.1039/C5JA00295H> doi:10.7892/boris.74443 info:doi:10.1039/C5JA00295H urn:issn:0267-9477 |
| Idioma(s) |
eng |
| Publicador |
Royal Society of Chemistry |
| Relação |
http://boris.unibe.ch/74443/ |
| Direitos |
info:eu-repo/semantics/openAccess |
| Fonte |
Riedo, Andreas; Grimaudo, Valentine; Moreno-García, P.; Neuland, Maike Brigitte; Tulej, Marek; Wurz, Peter; Broekmann, Peter (2015). High depth-resolution laser ablation chemical analysis of additive-assisted Cu electroplating for microchip architectures. Journal of analytical atomic spectrometry, 30(12), pp. 2371-2374. Royal Society of Chemistry 10.1039/C5JA00295H <http://dx.doi.org/10.1039/C5JA00295H> |
| Palavras-Chave | #570 Life sciences; biology #540 Chemistry #520 Astronomy #620 Engineering #530 Physics |
| Tipo |
info:eu-repo/semantics/article info:eu-repo/semantics/publishedVersion PeerReviewed |
