Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films


Autoria(s): Fraga, M. A.; Massi, M.; Oliveira, I. C.; Cruz, Nilson Cristino da; Santos Filho, S. G. dos
Contribuinte(s)

Universidade Estadual Paulista (UNESP)

Data(s)

20/05/2014

20/05/2014

01/01/2009

Resumo

Amorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films.

Formato

327-330

Identificador

http://www.scientific.net/MSF.615-617.327

Materials Science Forum, v. 615 617, p. 327-330.

0255-5476

http://hdl.handle.net/11449/130388

http://dx.doi.org/10.4028/www.scientific.net/MSF.615-617.327

WOS:000265961100078

2-s2.0-79251649240

Idioma(s)

eng

Publicador

Trans Tech Publications Ltd

Relação

Materials Science Forum

Direitos

closedAccess

Palavras-Chave #Silicon carbon nitride #Thermal annealing #Resistivity #Elastic modulus #Hardness
Tipo

info:eu-repo/semantics/conferencePaper