SILVER DISSOLUTION ON COPPER-BASED ALLOYS
| Contribuinte(s) |
Universidade Estadual Paulista (UNESP) |
|---|---|
| Data(s) |
20/05/2014
20/05/2014
15/01/1993
|
| Resumo |
Electrical resistivity measurements and scanning electron microscopy was used to study the dissolution of silver on Cu-Ag and Cu-Al-Ag alloys. The results seem to indicate that the dissolution temperature is affected by the addition of aluminium. |
| Formato |
411-414 |
| Identificador |
http://dx.doi.org/10.1007/BF00357818 Journal of Materials Science. London: Chapman Hall Ltd, v. 28, n. 2, p. 411-414, 1993. 0022-2461 http://hdl.handle.net/11449/31052 10.1007/BF00357818 WOS:A1993KM82300020 |
| Idioma(s) |
eng |
| Publicador |
Chapman Hall Ltd |
| Relação |
Journal of Materials Science |
| Direitos |
closedAccess |
| Tipo |
info:eu-repo/semantics/article |
