Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish
Data(s) |
01/09/2011
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Resumo |
The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability. <br /> |
Identificador | |
Idioma(s) |
eng |
Publicador |
Springer New York LLC |
Relação |
http://dro.deakin.edu.au/eserv/DU:30048007/nam-effectofgold-2011.pdf http://dx.doi.org/10.1007/s11664-011-1682-1 |
Direitos |
2011, TMS |
Palavras-Chave | #electronic materials #NiP #gold #corrosion resistance |
Tipo |
Journal Article |