Effect of gold on the corrosion behavior of an electroless nickel/immersion gold surface finish


Autoria(s): Bui, Q. V.; Nam, N. D.; Yoon, J. W.; Choi, D. H.; Kar, A.; Kim, J. G.; Jung, S. B.
Data(s)

01/09/2011

Resumo

The performance of surface finishes as a function of the pH of the utilized plating solution was evaluated by electrochemical impedance spectroscopy (EIS) and potentiodynamic polarization tests in 3.5 wt.% NaCl solution. In addition, the surface finishes were examined by x-ray diffraction (XRD), and the contact angle of the liquid/solid interface was recorded. NiP films on copper substrates with gold coatings exhibited their highest coating performance at pH 5. This was attributed to the films having the highest protective efficiency and charge transfer resistance, lowest porosity value, and highest contact angle among those examined as a result of the strongly preferred Au(111) orientation and the improved surface wettability. <br />

Identificador

http://hdl.handle.net/10536/DRO/DU:30048007

Idioma(s)

eng

Publicador

Springer New York LLC

Relação

http://dro.deakin.edu.au/eserv/DU:30048007/nam-effectofgold-2011.pdf

http://dx.doi.org/10.1007/s11664-011-1682-1

Direitos

2011, TMS

Palavras-Chave #electronic materials #NiP #gold #corrosion resistance
Tipo

Journal Article