Effect of Ag addition on the corrosion properties of Sn-based solder alloys


Autoria(s): Bui, Q. V.; Nam, N. D.; Noh, B.-I.; Kar, A.; Kim, J.-G.; Jung, S.-B.
Data(s)

01/01/2010

Resumo

Corrosion properties of three different Sn-Ag lead free solder alloys have been investigated in 0.3 wt% Na<sub>2</sub>SO<sub>4</sub> solution as corrosive environment. As cast solder alloy was analyzed by X-ray diffraction (XRD) and scanning electron microscopy (SEM). Volume fractions of the Ag<sub>3</sub>Sn in the solders were determined by image analysis technique. Pitting potential and corrosion potential for the alloys were determined by potentiodynamic tests. Electrochemical impedance spectroscopy (EIS) was carried out to measure the film and charge transfer resistance. Alloys with lower Ag content have been found as better corrosion resistance material.<br />

Identificador

http://hdl.handle.net/10536/DRO/DU:30047867

Idioma(s)

eng

Publicador

Wiley - VCH Verlag GmbH & Co. KGaA

Relação

http://dro.deakin.edu.au/eserv/DU:30047867/nam-effectof-2010.pdf

http://dx.doi.org/10.1002/maco.200905237

Direitos

2010, WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim

Palavras-Chave #alloy #corrosion #intermetallic compounds #lead free solder #microstructure
Tipo

Journal Article