Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining


Autoria(s): Yin, L; Vancoille, EYJ; Ramesh, K; Huang, H
Data(s)

01/01/2004

Resumo

Surface characterization of 6H-SiC (0001) substrates in indentation and abrasive machining was carried out to investigate microfracture, residual damage, and surface roughness associated with material removal and surface generation. Brittle versus plastic deformation was studied using Vickers indention and nano-indentation. To characterize the abrasive machining response, the 6H-SiC (0001) substrates were ground using diamond wheels with grit sizes of 25, 15 and 7 mum, and then polished with diamond suspensions of 3 and 0.05 mum. It is found that in indentation, there was a scale effect for brittle versus plastic deformation in 6H-SiC substrates. Also, in grinding, the scales of fracture and surface roughness of the substrates decreased with a decrease in diamond grit size. However, in polishing, a reduction in grit size of diamond suspensions gave no significant improvement in surface roughness. Furthermore, the results showed that fracture-free 6H-SiC (0001) surfaces were generated in polishing with the existence of the residual crystal defects, which were associated with the origin of defects in single crystal growth. (C) 2003 Elsevier Ltd. All rights reserved.

Identificador

http://espace.library.uq.edu.au/view/UQ:41122

Idioma(s)

eng

Publicador

Elsevier Sci Ltd

Palavras-Chave #Engineering, Manufacturing #Engineering, Mechanical #6h-sic (0001) Substrates #Grinding #Polishing #Nano-indentation #Vickers Indentation #Machining-induced Damage #Roughness #Diamond Tools #Silicon-carbide #Dental Handpiece #Ductile #Glass #Ceramics
Tipo

Journal Article