Nitrogen doping of SiC thin films deposited by RF magnetron sputtering


Autoria(s): FRAGA, Mariana Amorim; MASSI, Marcos; OLIVEIRA, Ivo C.; MACIEL, Homero S.; Santos Filho, Sebastiao Gomes dos; Mansano, Ronaldo Domingues
Contribuinte(s)

UNIVERSIDADE DE SÃO PAULO

Data(s)

18/10/2012

18/10/2012

2008

Resumo

Silicon carbide thin films (Si(x)C(y)) were deposited in a RF (13.56 MHz) magnetron sputtering system using a sintered SiC target (99.5% purity). In situ doping was achieved by introducing nitrogen into the electric discharge during the growth process of the films. The N(2)/Ar flow ratio was adjusted by varying the N(2) flow rate and maintaining constant the Ar flow rate. The structure, composition and bonds formed in the nitrogen-doped Si (x) C (y) thin films were investigated by X-ray diffraction (XRD), Rutherford backscattering spectroscopy (RBS), Raman spectroscopy and Fourier transform infrared spectrometry (FTIR) techniques. RBS results indicate that the carbon content in the film decreases as the N(2)/Ar flow ratio increases. Raman spectra clearly reveal that the deposited nitrogen-doped SiC films are amorphous and exhibited C-C bonds corresponding to D and G bands. After thermal annealing, the films present structural modifications that were identified by XRD, Raman and FTIR analyses.

Identificador

JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, v.19, n.8/Set, p.835-840, 2008

0957-4522

http://producao.usp.br/handle/BDPI/18648

10.1007/s10854-007-9487-y

http://dx.doi.org/10.1007/s10854-007-9487-y

Idioma(s)

eng

Publicador

SPRINGER

Relação

Journal of Materials Science-materials in Electronics

Direitos

restrictedAccess

Copyright SPRINGER

Palavras-Chave #CHEMICAL-VAPOR-DEPOSITION #SILICON-CARBIDE #GROWTH #Engineering, Electrical & Electronic #Materials Science, Multidisciplinary #Physics, Applied #Physics, Condensed Matter
Tipo

article

proceedings paper

publishedVersion