Electrical and Mechanical Properties of Post-annealed SiC(x)N(y) Films


Autoria(s): FRAGA, M. A.; MASSI, M.; OLIVEIRA, I. C.; CRUZ, N. C.; Santos Filho, Sebastiao Gomes dos
Contribuinte(s)

UNIVERSIDADE DE SÃO PAULO

Data(s)

18/10/2012

18/10/2012

2009

Resumo

Amorphous SiC(x)N(y) films have been deposited on (100) Si substrates by RF magnetron sputtering of a SiC target in a variable nitrogen-argon atmosphere. The as-deposited films were submitted to thermal anneling in a furnace under argon atmosphere at 1000 degrees C for 1 hour. Composition and structure of unannealed and annealed samples were investigated by RBS and FTIR. To study the electrical characteristics of SiC(x)N(y) films, Metal-insulator-semiconductor (MIS) structures were fabricated. Elastic modulus and hardness of the films were determined by nanoindentation. The results of these studies showed that nitrogen content and thermal annealing affect the electrical, mechanical and structural properties of SiC(x)N(y) films.

Identificador

SILICON CARBIDE AND RELATED MATERIALS 2008, v.615-617, p.327-330, 2009

0255-5476

http://producao.usp.br/handle/BDPI/18635

http://apps.isiknowledge.com/InboundService.do?Func=Frame&product=WOS&action=retrieve&SrcApp=EndNote&UT=000265961100078&Init=Yes&SrcAuth=ResearchSoft&mode=FullRecord

Idioma(s)

eng

Publicador

TRANS TECH PUBLICATIONS LTD

Relação

Silicon Carbide and Related Materials 2008

Direitos

restrictedAccess

Copyright TRANS TECH PUBLICATIONS LTD

Palavras-Chave #silicon carbon nitride #thermal annealing #resistivity #elastic modulus #hardness #THIN-FILMS #Materials Science, Multidisciplinary
Tipo

article

original article

publishedVersion