Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon


Autoria(s): Goel, Saurav
Data(s)

2012

Identificador

http://pure.qub.ac.uk/portal/en/publications/simulation-study-of-cutting-forces-stresses-and-temperature-during-nanometric-cutting-of-single-crystal-silicon(ecc9e3e0-4b50-4c26-afe8-ff19b1f38d7f).html

http://dx.doi.org/10.4028/www.scientific.net/KEM.496.223

Idioma(s)

eng

Direitos

info:eu-repo/semantics/restrictedAccess

Fonte

Goel , S 2012 , ' Simulation Study of Cutting Forces, Stresses and Temperature during Nanometric Cutting of Single Crystal Silicon ' Key Engineering Materials . DOI: 10.4028/www.scientific.net/KEM.496.223

Tipo

article