Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading

Autoria(s): YUAN, H; Chen, Jian Fei; TENG, JG; LU, XZ
Data(s)

2007
Identificador

http://pure.qub.ac.uk/portal/en/publications/interfacial-stress-analysis-of-a-thin-plate-bonded-to-a-rigid-substrate-and-subjected-to-inclined-loading(38329ee7-beb4-49b8-88e1-5c11022ddf4e).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

YUAN , H , Chen , J F , TENG , J G & LU , X Z 2007 , ' Interfacial stress analysis of a thin plate bonded to a rigid substrate and subjected to inclined loading ' International Journal of Solids and Structures , vol 44 , no. 16 , pp. 5247-5271 .
Tipo

article
Acesso ao item digital