Thermal Vias for SOI Technology

Autoria(s): Baine, Paul; Uppal, S.; Bain, Michael; Armstrong, Mervyn; Mitchell, Neil; Gamble, Harold
Data(s)

01/10/2000
Identificador

http://pure.qub.ac.uk/portal/en/publications/thermal-vias-for-soi-technology(34e250ba-0d98-4e28-89b0-ccfd03e85135).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Baine , P , Uppal , S , Bain , M , Armstrong , M , Mitchell , N & Gamble , H 2000 , ' Thermal Vias for SOI Technology ' Paper presented at International Conf. on Communications, Computers & Devices , Kharagpur , India , 01/11/2000 , pp. 239-242 .
Tipo

conferenceObject
Acesso ao item digital