Electroless copper deposits using glyoxylic acid as reducing agents

Autoria(s): Wu, X.; Sha, Wei
Data(s)

01/09/2007
Identificador

http://pure.qub.ac.uk/portal/en/publications/electroless-copper-deposits-using-glyoxylic-acid-as-reducing-agents(c506d997-30bd-452a-b192-eb67ec9eca32).html
Idioma(s)

eng
Publicador

Unknown Publisher
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Wu , X & Sha , W Electroless copper deposits using glyoxylic acid as reducing agents .
Tipo

other
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