Surface morphology of electroless copper plating in different plating conditions

Autoria(s): Wu, X.; Sha, Wei
Data(s)

01/01/2007
Identificador

http://pure.qub.ac.uk/portal/en/publications/surface-morphology-of-electroless-copper-plating-in-different-plating-conditions(16d92fee-4e31-499b-ae55-7f85861f6882).html
Idioma(s)

eng
Publicador

Unknown Publisher
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Wu , X & Sha , W Surface morphology of electroless copper plating in different plating conditions .
Tipo

other
Acesso ao item digital