Surface morphology of electroless copper plating using different chemicals as reducing agent

Autoria(s): Wu, X.; Sha, Wei
Data(s)

01/07/2006
Identificador

http://pure.qub.ac.uk/portal/en/publications/surface-morphology-of-electroless-copper-plating-using-different-chemicals-as-reducing-agent(b3e0ecac-6534-4fa5-9d99-4588344c5e57).html
Idioma(s)

eng
Publicador

Unknown Publisher
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Wu , X & Sha , W , Surface morphology of electroless copper plating using different chemicals as reducing agent , 2006 , Exhibition , Unknown Publisher , Microscopy & Microanalysis 2006 Meeting, Chicago, Illinois, USA .
Tipo

other
Acesso ao item digital