Surface morphology of electroplated and electroless copper deposits

Autoria(s): Keong, K.G.; Sha, Wei; Malinov, Savko
Data(s)

01/08/2001
Identificador

http://pure.qub.ac.uk/portal/en/publications/surface-morphology-of-electroplated-and-electroless-copper-deposits(c64a75b8-4096-4e0f-ae78-3667931e771a).html
Idioma(s)

eng
Publicador

Unknown Publisher
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Keong , K G , Sha , W & Malinov , S Surface morphology of electroplated and electroless copper deposits .
Tipo

other
Acesso ao item digital