Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits

Autoria(s): Keong, K.G.; Sha, Wei; Guo, Z.X.; Malinov, Savko
Data(s)

01/08/2001
Identificador

http://pure.qub.ac.uk/portal/en/publications/surface-morphology-microhardness-and-residual-stress-of-electroplated-and-electroless-copper-deposits(aa25bfc5-619b-491f-b9ce-cc91b7471a8f).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Keong , K G , Sha , W , Guo , Z X & Malinov , S 2001 , ' Surface morphology, microhardness and residual stress of electroplated and electroless copper deposits ' Paper presented at International Conference on Surface and Interface Science and Engineering SISE’2001 , Shenzhen , China , 01/08/2001 - 01/08/2001 , pp. 88-88 .
Tipo

conferenceObject
Acesso ao item digital