Surface morphology and residual stress of electroplated and electroless copper deposits
| Data(s) |
01/06/2001
|
|---|---|
| Identificador | |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
Keong , K G , Sha , W , Guo , Z X & Malinov , S 2001 , ' Surface morphology and residual stress of electroplated and electroless copper deposits ' Paper presented at 5th International Conference on Computer Methods and Experimental Measurements for Surface Treatment Effects , Seville , Spain , 01/06/2001 - 01/06/2001 , pp. 285-299 . |
| Tipo |
conferenceObject |
