Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits
| Data(s) |
2001
|
|---|---|
| Identificador | |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
Keong , K G & Sha , W 2001 , ' Test methods for measuring tensile strength and ductility of electroplated and electroless copper deposits ' Materials Science And Technology , vol 17 , no. 9 , pp. 1033-1038 . |
| Palavras-Chave | #/dk/atira/pure/subjectarea/asjc/2500 #Materials Science(all) #/dk/atira/pure/subjectarea/asjc/2500/2506 #Metals and Alloys |
| Tipo |
article |
