Comment on “Influence of additives and the effect of aging in modifying surface topography of electrodeposited copper” [J. Electrochem. Soc., 156, D215 (2009)]

Autoria(s): Sha, Wei
Data(s)

2011
Identificador

http://pure.qub.ac.uk/portal/en/publications/comment-on-influence-of-additives-and-the-effect-of-aging-in-modifying-surface-topography-of-electrodeposited-copper-j-electrochem-soc-156-d215-2009(2f14fc51-b4c6-4be2-93e3-bb574c3dbf0a).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Sha , W 2011 , ' Comment on “Influence of additives and the effect of aging in modifying surface topography of electrodeposited copper” [J. Electrochem. Soc., 156, D215 (2009)] ' Journal of the Electrochemical Society , vol 158 , pp. S6-S7 .
Tipo

article
Acesso ao item digital