Production of diaphragms over a cavity by grinding to reduce wafer thickness

Autoria(s): Gamble, Harold; Mitchell, Neil; Prochaska, A.; Fitzgerald, S.P.
Data(s)

01/04/2003
Identificador

http://pure.qub.ac.uk/portal/en/publications/production-of-diaphragms-over-a-cavity-by-grinding-to-reduce-wafer-thickness(b5c85076-e685-4c9b-a83b-69ad0cec9acb).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Gamble , H , Mitchell , N , Prochaska , A & Fitzgerald , S P 2003 , Production of diaphragms over a cavity by grinding to reduce wafer thickness , Patent No. US Patent 6,551,851 .
Tipo

patent
Acesso ao item digital