Copper flip chip bump interconnect technology for microwave subsystems including RF characterization

Autoria(s): Wong, Meng Seng (Kenn; Linton, David
Data(s)

01/12/2000
Identificador

http://pure.qub.ac.uk/portal/en/publications/copper-flip-chip-bump-interconnect-technology-for-microwave-subsystems-including-rf-characterization(cdf48842-3567-430b-9d92-54bceb842e66).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Wong , M S K & Linton , D 2000 , ' Copper flip chip bump interconnect technology for microwave subsystems including RF characterization ' Paper presented at 3rd Electronics Packaging Technology Conference , Singapore , Singapore , 01/12/2000 - 01/12/2000 , pp. 335-338 .
Tipo

conferenceObject
Acesso ao item digital