Application of SU-8 in flip chip bump micromachining for millimeter wave applications

Autoria(s): Wong, Meng Seng (Kenn; Linton, David
Data(s)

01/12/2000
Identificador

http://pure.qub.ac.uk/portal/en/publications/application-of-su8-in-flip-chip-bump-micromachining-for-millimeter-wave-applications(6910f5c6-65ca-4f9a-8f2b-a837f1093559).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Wong , M S K & Linton , D 2000 , ' Application of SU-8 in flip chip bump micromachining for millimeter wave applications ' Paper presented at 3rd Electronics Packaging Technology Conference , Singapore , Singapore , 01/12/2000 - 01/12/2000 , pp. 204-209 .
Tipo

conferenceObject
Acesso ao item digital