Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding

Autoria(s): Low, Y.W.; Gamble, Harold; Armstrong, Mervyn; Rainey, Paul; Baine, Paul; Montgomery, John; Mitchell, Neil; McNeill, David
Data(s)

01/06/2010
Identificador

http://pure.qub.ac.uk/portal/en/publications/surface-activation-treatment-using-atmospheric-pressure-plasma-for-low-temeprature-direct-wafer-bonding(9615118a-5cd5-47cd-b1b0-fccbe19a4631).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Low , Y W , Gamble , H , Armstrong , M , Rainey , P , Baine , P , Montgomery , J , Mitchell , N & McNeill , D 2010 , ' Surface activation treatment using atmospheric pressure plasma for low temeprature direct wafer bonding ' Paper presented at UK-Malaysia-Ireland Engineering Science Conference, UMIES 2010 , Belfast , United Kingdom , 01/06/2010 - 01/06/2010 , pp. 0-0 .
Tipo

conferenceObject
Acesso ao item digital