Atmospheric-pressure plasma activation for low temperature bonding

Autoria(s): Low, Y.W.; Rainey, Paul; Baine, Paul; Montgomery, John; Mitchell, Neil; McNeill, David; Gamble, Harold; Armstrong, Mervyn
Data(s)

01/10/2010
Identificador

http://pure.qub.ac.uk/portal/en/publications/atmosphericpressure-plasma-activation-for-low-temperature-bonding(9d7adce2-1131-4558-83d7-ba0962af5822).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Low , Y W , Rainey , P , Baine , P , Montgomery , J , Mitchell , N , McNeill , D , Gamble , H & Armstrong , M 2010 , ' Atmospheric-pressure plasma activation for low temperature bonding ' Paper presented at 218th ECS Meeting, Semiconductor Wafer Bonding: Science, Technology & Applications , Las Vegas , United States , 01/10/2010 - 01/10/2010 , pp. 0-0 .
Tipo

conferenceObject
Acesso ao item digital