The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding

Autoria(s): Low, Y.W.; Rainey, Paul; Baine, Paul; Montgomery, John; McNeill, David; Mitchell, Neil; Gamble, Harold; Armstrong, Mervyn
Data(s)

01/12/2009
Identificador

http://pure.qub.ac.uk/portal/en/publications/the-effect-of-atmospheric-oxygen-plasma-on-buried-oxide-layer-for-low-temeprature-wafer-bonding(810fa3bb-87e2-4170-8713-7b1146d0a048).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Low , Y W , Rainey , P , Baine , P , Montgomery , J , McNeill , D , Mitchell , N , Gamble , H & Armstrong , M 2009 , ' The effect of atmospheric oxygen plasma on buried oxide layer for low temeprature wafer bonding ' Paper presented at Materials Ireland Conference , Cork , Ireland , 01/12/2009 - 01/12/2009 , pp. 0-0 .
Tipo

conferenceObject
Acesso ao item digital