Effects of copper grain structure on electromigration behaviour
| Data(s) |
01/09/2001
|
|---|---|
| Identificador |
http://www.scopus.com/inward/record.url?scp=1842791696&partnerID=8YFLogxK |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
Toh , B H W , McNeill , D & Gamble , H 2001 , ' Effects of copper grain structure on electromigration behaviour ' Paper presented at Proceedings of 9th International Symposium on Integrated Circuits, Devices & Systems , Singapore , Singapore , 01/09/2001 - 01/09/2001 , pp. 39-42 . |
| Tipo |
conferenceObject |
