A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP

Autoria(s): McCusker, N.D.; Len, V.S.C.; Toh, B.H.W.; McNeill, David; Gamble, Harold
Data(s)

01/10/2000
Identificador

http://pure.qub.ac.uk/portal/en/publications/a-comparative-study-into-surface-electromigration-of-sputtered-copper-patterned-using-liftoff-and-cmp(ad7f171b-042d-4139-8ac5-43a3aa3566db).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

McCusker , N D , Len , V S C , Toh , B H W , McNeill , D & Gamble , H 2000 , ' A comparative study into surface electromigration of sputtered copper patterned using lift-off and CMP ' Paper presented at Proceedings of 3rd International Conference on Materials for Microelectronics , Dublin , Ireland , 01/10/2000 - 01/10/2000 , pp. 93-96 .
Tipo

conferenceObject
Acesso ao item digital