Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing
| Data(s) |
01/06/2001
|
|---|---|
| Identificador |
http://www.scopus.com/inward/record.url?scp=0035299493&partnerID=8YFLogxK |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
Toh , B W H , McCusker , N D , McNeill , D , Gamble , H & Len , V S C 2001 , ' Surface electromigration of sputtered copper patterned using ion milling or chemical mechanical polishing ' Journal of Materials Science: Materials in Electronics , vol 12(4-6) , no. 4-6 , pp. 307-312 . |
| Palavras-Chave | #/dk/atira/pure/subjectarea/asjc/2200/2208 #Electrical and Electronic Engineering #/dk/atira/pure/subjectarea/asjc/2500 #Materials Science(all) #/dk/atira/pure/subjectarea/asjc/2500/2504 #Electronic, Optical and Magnetic Materials #/dk/atira/pure/subjectarea/asjc/3100/3104 #Condensed Matter Physics |
| Tipo |
article |
