Application of atmospheric plasma for low temperature wafer bonding

Autoria(s): Low, Y.W.; Rainey, Paul; Baine, Paul; Montgomery, John; McNeill, David; Mitchell, Neil; Gamble, Harold; Armstrong, Mervyn
Data(s)

01/04/2010
Identificador

http://pure.qub.ac.uk/portal/en/publications/application-of-atmospheric-plasma-for-low-temperature-wafer-bonding(ba188fe8-efe3-4e0d-894b-2c212258ca50).html

http://www.scopus.com/inward/record.url?scp=78650575760&partnerID=8YFLogxK
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Low , Y W , Rainey , P , Baine , P , Montgomery , J , McNeill , D , Mitchell , N , Gamble , H & Armstrong , M 2010 , ' Application of atmospheric plasma for low temperature wafer bonding ' ECS Transactions , vol 28(1) , pp. 385-393 .
Tipo

article
Acesso ao item digital