Microwave curing of materials for high density packaging

Autoria(s): Goussetis, George; Sinclair, K.I.; Sangster, A.J.; Desmulliez, M.P.Y.; Tilford, T.; Parrott, A.K.; Bailey, C.
Data(s)

01/06/2007
Identificador

http://pure.qub.ac.uk/portal/en/publications/microwave-curing-of-materials-for-high-density-packaging(4401b59e-3036-4ab1-9e8b-067a797ece94).html

http://www.scopus.com/inward/record.url?scp=40949166265&partnerID=8YFLogxK
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Goussetis , G , Sinclair , K I , Sangster , A J , Desmulliez , M P Y , Tilford , T , Parrott , A K & Bailey , C 2007 , ' Microwave curing of materials for high density packaging ' Paper presented at International Symposium on High Density Packaging and Microsystems Integration , Shanghai , China , 01/06/2007 - 01/06/2007 , pp. 30-30 .
Tipo

conferenceObject
Acesso ao item digital