Variable frequency microwave curing of polymer materials in microelectronics packaging applications
| Data(s) |
01/12/2007
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|---|---|
| Identificador |
http://www.scopus.com/inward/record.url?scp=50049118320&partnerID=8YFLogxK |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
Tilford , T , Sinclair , K L , Goussetis , G , Bailey , C , Desmulliez , M P Y , Parrott , A K & Sangster , A J 2007 , ' Variable frequency microwave curing of polymer materials in microelectronics packaging applications ' Paper presented at 9th Electronics Packaging Technology Conference , Singapore , Singapore , 01/12/2007 - 01/12/2007 , pp. 791-796 . |
| Tipo |
conferenceObject |
