Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing

Autoria(s): Tilford, T.; Sinclair, K.I.; Goussetis, George; Bailey, C.; Desmulliez, M.P.Y.; Parrott, A.K.; Sangster, A.J.
Data(s)

01/05/2008
Identificador

http://pure.qub.ac.uk/portal/en/publications/numerical-analysis-of-thermal-stresses-induced-during-vfm-encapsulant-curing(7f95c41b-38fe-4e3c-9faf-d2f3164ce9ec).html

http://www.scopus.com/inward/record.url?scp=71249125753&partnerID=8YFLogxK
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Tilford , T , Sinclair , K I , Goussetis , G , Bailey , C , Desmulliez , M P Y , Parrott , A K & Sangster , A J 2008 , ' Numerical Analysis of Thermal Stresses Induced During VFM Encapsulant Curing ' Paper presented at 31st International Spring Seminar on Electronics Technology , Budapest , Hungary , 01/05/2008 - 01/05/2008 , pp. 348-353 .
Tipo

conferenceObject
Acesso ao item digital