Novel materials for thermal via incorporation into SOI structures

Autoria(s): Baine, Paul; Choon, K.Y.; Gamble, Harold; Armstrong, Mervyn; Mitchell, Neil
Data(s)

01/10/2000
Identificador

http://pure.qub.ac.uk/portal/en/publications/novel-materials-for-thermal-via-incorporation-into-soi-structures(dd581f4a-999e-4eb9-9434-f6bc484e2fc7).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Baine , P , Choon , K Y , Gamble , H , Armstrong , M & Mitchell , N 2000 , ' Novel materials for thermal via incorporation into SOI structures ' Paper presented at 3rd International Conference on Materials in Microelectronics , Dublin , Ireland , 01/10/2001 - 01/10/2001 , .
Tipo

conferenceObject
Acesso ao item digital