Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images


Autoria(s): Wu, X.; Sha, Wei
Data(s)

15/01/2009

Identificador

http://pure.qub.ac.uk/portal/en/publications/experimental-study-of-the-voids-in-the-electroless-copper-deposits-and-the-direct-measurement-of-the-void-fraction-based-on-the-scanning-electron-microscopy-images(3f38a749-6006-444a-b6bb-40451e69a6ed).html

http://www.scopus.com/inward/record.url?scp=58149085271&partnerID=8YFLogxK

Idioma(s)

eng

Direitos

info:eu-repo/semantics/restrictedAccess

Fonte

Wu , X & Sha , W 2009 , ' Experimental study of the voids in the electroless copper deposits and the direct measurement of the void fraction based on the scanning electron microscopy images ' Applied Surface Science , vol 255 , no. 7 , pp. 4259-4266 .

Palavras-Chave #/dk/atira/pure/subjectarea/asjc/2500/2508 #Surfaces, Coatings and Films
Tipo

article