Surface morphology of electroless copper deposits using different reducing agents


Autoria(s): Wu, X.; Sha, Wei
Data(s)

01/04/2008

Identificador

http://pure.qub.ac.uk/portal/en/publications/surface-morphology-of-electroless-copper-deposits-using-different-reducing-agents(aad43037-a412-450a-89c2-6db910a4b269).html

http://www.scopus.com/inward/record.url?scp=48249140631&partnerID=8YFLogxK

Idioma(s)

eng

Direitos

info:eu-repo/semantics/restrictedAccess

Fonte

Wu , X & Sha , W 2008 , ' Surface morphology of electroless copper deposits using different reducing agents ' Synthesis and Reactivity in Inorganic, Metal-Organic, and Nano-Metal Chemistry , vol 38 , no. 3 PART 2 , pp. 292-296 .

Palavras-Chave #/dk/atira/pure/subjectarea/asjc/1600/1604 #Inorganic Chemistry
Tipo

article