Surface morphology of electroless copper deposits using different reducing agents
Data(s) |
01/04/2008
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Identificador |
http://www.scopus.com/inward/record.url?scp=48249140631&partnerID=8YFLogxK |
Idioma(s) |
eng |
Direitos |
info:eu-repo/semantics/restrictedAccess |
Fonte |
Wu , X & Sha , W 2008 , ' Surface morphology of electroless copper deposits using different reducing agents ' Synthesis and Reactivity in Inorganic, Metal-Organic, and Nano-Metal Chemistry , vol 38 , no. 3 PART 2 , pp. 292-296 . |
Palavras-Chave | #/dk/atira/pure/subjectarea/asjc/1600/1604 #Inorganic Chemistry |
Tipo |
article |