Integration of ultrathin SOI using ion split and etch back processes

Autoria(s): Armstrong, Mervyn; Baine, Paul; Gamble, Harold; McNeill, David; Suder, Suli
Data(s)

01/01/2007
Identificador

http://pure.qub.ac.uk/portal/en/publications/integration-of-ultrathin-soi-using-ion-split-and-etch-back-processes(2da0d873-16ac-4383-ac50-bd6f6ea651b2).html
Idioma(s)

eng
Direitos

info:eu-repo/semantics/restrictedAccess
Fonte

Armstrong , M , Baine , P , Gamble , H , McNeill , D & Suder , S 2007 , ' Integration of ultrathin SOI using ion split and etch back processes ' Paper presented at Proc. EUROSOI 2007 Workshop of the Thematic Network on Silicon on Insulator technology, devices & circuits , Leuven , Belgium , 01/01/2007 - 01/01/2007 , pp. 19-20 .
Tipo

conferenceObject
Acesso ao item digital