Novel materials for thermal via incorporation into SOI structures
| Data(s) |
01/06/2001
|
|---|---|
| Identificador |
http://dx.doi.org/10.1023/A:1011247000996 http://www.scopus.com/inward/record.url?scp=0035299481&partnerID=8YFLogxK |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
Baine , P , Choon , K Y , Gamble , H , Armstrong , M & Mitchell , N 2001 , ' Novel materials for thermal via incorporation into SOI structures ' Journal of Materials Science: Materials in Electronics , vol 12(4/6) , no. 4-6 , pp. 215-218 . DOI: 10.1023/A:1011247000996 |
| Palavras-Chave | #/dk/atira/pure/subjectarea/asjc/2200/2208 #Electrical and Electronic Engineering #/dk/atira/pure/subjectarea/asjc/2500 #Materials Science(all) #/dk/atira/pure/subjectarea/asjc/2500/2504 #Electronic, Optical and Magnetic Materials #/dk/atira/pure/subjectarea/asjc/3100/3104 #Condensed Matter Physics |
| Tipo |
article |
