Comparison of induced stresses due to electroless versus sputtered copper interconnect technology
| Data(s) |
01/11/2004
|
|---|---|
| Identificador |
http://dx.doi.org/10.1088/0268-1242/19/11/012 http://www.scopus.com/inward/record.url?scp=9144249214&partnerID=8YFLogxK |
| Idioma(s) |
eng |
| Direitos |
info:eu-repo/semantics/restrictedAccess |
| Fonte |
McNally , P J , Kanatharana , J , Toh , B H W , McNeill , D , Tuomi , T , Danilewsky , A N , Knuuttila , L , Riikonen , J & Toivonen , J 2004 , ' Comparison of induced stresses due to electroless versus sputtered copper interconnect technology ' Semiconductor Science and Technology , vol 19(11) , no. 11 , pp. 1280-1284 . DOI: 10.1088/0268-1242/19/11/012 |
| Palavras-Chave | #/dk/atira/pure/subjectarea/asjc/2200/2208 #Electrical and Electronic Engineering #/dk/atira/pure/subjectarea/asjc/2500 #Materials Science(all) #/dk/atira/pure/subjectarea/asjc/2500/2504 #Electronic, Optical and Magnetic Materials #/dk/atira/pure/subjectarea/asjc/3100/3104 #Condensed Matter Physics |
| Tipo |
article |
