Comparison of encapsulant curing with convention and microwave systems


Autoria(s): Tilford, Tim; Sinclair, Keith I.; Goussetis, George; Bailey, Christopher; Desmulliez, Marc P.Y.; Parrott, Kevin; Sangster, Alan J.
Data(s)

01/11/2008

Resumo

Comparison of the performance of a conventional convection oven system with a dual-section microwave system for curing thermosetting polymer encapsulant materials has been performed numerically. A numerical model capable of analysing both the convection and microwave cure processes has been developed and is breifly outliines. The model is used to analyse the curing of a commercially available encapsulant material using both systems. Results obtained from numerical solutions are presented, confirming that the VFM system enables the cure process to be carried out far more rapidly than with the convection oven system. This capability stems from the fundamental heating processes involved, namely that microwave processing enables the heating rate to be varied independently of the material temperature. Variations in cure times, curing rates, maximum temperatures and residual stresses between the processes are fully discussed.

Formato

application/pdf

Identificador

http://gala.gre.ac.uk/1219/1/08_29.pdf

Tilford, Tim, Sinclair, Keith I., Goussetis, George, Bailey, Christopher, Desmulliez, Marc P.Y., Parrott, Kevin and Sangster, Alan J. (2008) Comparison of encapsulant curing with convention and microwave systems. 33rd IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT), 2008. IEEE, Piscataway, NJ, USA. ISBN 9781424433926 (print) 9781424433933 (electronic) (doi:10.1109/IEMT.2008.5507869 <http://doi.org/10.1109/IEMT.2008.5507869>)

Idioma(s)

en

Publicador

IEEE

Relação

http://gala.gre.ac.uk/1219/

http://dx.doi.org/10.1109/IEMT.2008.5507869

10.1109/IEMT.2008.5507869

Palavras-Chave #TK Electrical engineering. Electronics Nuclear engineering #QA76 Computer software
Tipo

Book Section

PeerReviewed