Morphology and thermal properties of conductive polyaniline/polyamide composite films

Polyaniline (PANI) in an emeraldine-base form, synthesized by chemical oxidation polymerization, was doped with camphor sulfonic acid (CSA). The conducting complex (PANI-CSA) and a matrix, polyamide-66, polyamide-11, or polyamide-1010, were dissolved in a mixed solvent, and the blend solution was dropped onto glass and dried for the preparation of PANI/polyamide composite films. The conductivity of the films ranged from 10(-7) to 10(0) S/cm when the weight fraction of PANI-CSA in the matrices changed from 0.01 to 0.09, and the percolation threshold was about 2 wt %. The morphology of the composite films before and after etching was studied with scanning electron microscopy, and the thermal properties of the composite films were monitored with differential scanning calorimetry. The results indicated that the morphology of the blend systems was in a globular form. The addition of PANI-CSA to the films resulted in a decrease in the melting temperature of the composite films and also affected the crystallinity of the blend systems.