Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe

Autoria(s): Wang JL(王建立); Gu M(顾明); Zhang X(张兴); Wu GP(吴刚平)
Data(s)

2009
Identificador

http://ir.sxicc.ac.cn/handle/0/4116

http://www.irgrid.ac.cn/handle/1471x/150327
Idioma(s)

英语
Fonte

王建立,顾明,张兴,吴刚平.Measurements of thermal effusivity of a fine wire and contact resistance of a junction using a T type probe.Review of Scientific Instruments,2009,80(7):No. 076107
Tipo

期刊论文
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