High-Temperature Joining of Carbon/Carbon Composites by an Organic Resin Adhesive

Autoria(s): Wang JG(王继刚); Jiang Haiyun; Guo QG(郭全贵); Liu L(刘朗); Song JR(宋进仁); Bai Shihong; Qiao Shengru
Data(s)

2009
Identificador

http://ir.sxicc.ac.cn/handle/0/4109

http://www.irgrid.ac.cn/handle/1471x/150319
Idioma(s)

英语
Fonte

王继刚,Jiang Haiyun,郭全贵,刘朗,宋进仁,Bai Shihong,Qiao Shengru.High-Temperature Joining of Carbon/Carbon Composites by an Organic Resin Adhesive.Journal of Adhesion Science and Technology ,2009,23(1):115-123
Tipo

期刊论文
Acesso ao item digital