Study on the microstuctural evolution of high temperature adhesives for graphite bonding

Autoria(s): Wang JG(王继刚); Guo QG(郭全贵); Liu L(刘朗); Song JR(宋进仁)
Data(s)

2002
Identificador

http://ir.sxicc.ac.cn/handle/0/3513

http://www.irgrid.ac.cn/handle/1471x/149819
Idioma(s)

英语
Fonte

王继刚,郭全贵,刘朗,宋进仁.Study on the microstuctural evolution of high temperature adhesives for graphite bonding.Carbon,2002,40(13):2447-2452
Tipo

期刊论文
Acesso ao item digital