Interface energy and its influence on interface fracture between metal and ceramic thin films in nanoscale


Autoria(s): 梁立红; 尤雪梅; 马寒松; 魏悦广
Data(s)

2010

Resumo

A theoretical model about the size-dependent interface energy between two thin films with different materials is developed by considering the chemical bonding contribution based on the thermodynamic expressions and the structure strain contribution based on the mechanical characteristics. The interface energy decreases with reducing thickness of thin films, and is determined by such available thermodynamic and mechanical parameters as the melting entropy, the melting enthalpy, the shear modulus of two materials, etc. The predicted interface energies of some metal/MgO and metal/Al2O3 interfaces based on the model are consistent with the results based on the molecular mechanics calculation. Furthermore, the interface fracture properties of Ag/MgO and Ni/Al2O3 based on the atomistic simulation are further compared with each other. The fracture strength and the toughness of the interface with the smaller structure interface energy are both found to be lower. The intrinsic relations among the interface energy, the interface strength, and the fracture toughness are discussed by introducing the related interface potential and the interface stress. The microscopic interface fracture toughness is found to equal the structure interface energy in nanoscale, and the microscopic fracture strength is proportional to the fracture toughness. (C) 2010 American Institute of Physics. [doi:10.1063/1.3501090]

NSFC [10802088, 10832008, 10702070]

LNM [10721202, 10932011]

Identificador

http://dspace.imech.ac.cn/handle/311007/43447

http://www.irgrid.ac.cn/handle/1471x/124431

Idioma(s)

英语

Fonte

JOURNAL OF APPLIED PHYSICS.2010,108(8):84317

Palavras-Chave #Misfit Dislocation #Metal/Oxide Interfaces #Atomistic Simulation #Toughness #Stresses #Scale #Model
Tipo

期刊论文