VCSEL based optoelectronic multiple chip modules


Autoria(s): Chen HD; Liang K; Du Y; Huang YZ; Tiang J; Ma XY; Wu RH; Li SY; Guo WL; Xu GJ; Wang Y
Data(s)

2000

Resumo

We report on optoelectronic multiple chip modules, consisting of vertical cavity surface emitting laser(VCSEL), photodetector and 1.2 mum CMOS electronic circuit, The hybrid integrated components operate at a date rate of 155Mb/s, which could be used in optical interconnects for multiple computers.

We report on optoelectronic multiple chip modules, consisting of vertical cavity surface emitting laser(VCSEL), photodetector and 1.2 mum CMOS electronic circuit, The hybrid integrated components operate at a date rate of 155Mb/s, which could be used in optical interconnects for multiple computers.

于2010-10-29批量导入

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China Opt & Optoelectr Manufacturers Assoc.; Chinese Phys Soc.; SPIE.

Chinese Acad Sci, Inst Semicond, State Key Lab Integrated Optoelect, Beijing 100083, Peoples R China

China Opt & Optoelectr Manufacturers Assoc.; Chinese Phys Soc.; SPIE.

Identificador

http://ir.semi.ac.cn/handle/172111/13721

http://www.irgrid.ac.cn/handle/1471x/105042

Idioma(s)

英语

Publicador

SPIE-INT SOC OPTICAL ENGINEERING

1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA

Fonte

Chen HD; Liang K; Du Y; Huang YZ; Tiang J; Ma XY; Wu RH; Li SY; Guo WL; Xu GJ; Wang Y .VCSEL based optoelectronic multiple chip modules .见:SPIE-INT SOC OPTICAL ENGINEERING .OPTICAL INTERCONNECTS FOR TELECOMMUNICATION AND DATA COMMUNICATIONS, 4225,1000 20TH ST, PO BOX 10, BELLINGHAM, WA 98227-0010 USA ,2000,112-115

Palavras-Chave #光电子学 #VCSEL #photodetector #CMOS #MCM #optoelectronic integration #optical interconnects #SURFACE-EMITTING LASERS #MQW MODULATORS #INTEGRATION #CIRCUITS #VLSI
Tipo

会议论文